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| 1 | The‘skin effect’of subsurface damage distribution in materials subjected to high-speed machining显示文摘This paper proposes the‘skin effect’of the machining-induced damage at high strain rates.The paper first reviews the published research work on machining-induced damage and then identifies the governing factors that dominate damage formation mechanisms.Among many influential factors,such as stress-strain field,temperature field,material responses to loading and loading rate,and crack initiation and propagation,strain rate is recognized as a dominant factor that can directly lead to the‘skin effect’of material damage in a loading process.The paper elucidates that material deformation at high strain rates(>103 s−1)leads to the embrittlement,which in turn contributes to the‘skin effect’of subsurface damage.The paper discusses the‘skin effect’based on the principles of dislocation kinetics and crack initiation and propagation.It provides guidance to predicting the material deformation and damage at a high strain-rate for applications ranging from the armor protection,quarrying,petroleum drilling,and high-speed machining of engineering materials(e.g.ceramics and SiC reinforced aluminum alloys). | Bi Zhang Jingfei Yin | 2019 | International Journal of Extreme Manufacturing2019，1，1： | 11 |
| 2 | Formation of subsurface cracks in silicon wafers by grinding显示文摘Single-crystal silicon is an important material in the semiconductor and optical industries.However,being hard and brittle,a silicon wafer is vulnerable to subsurface cracks(SSCs)during grinding,which is detrimental to the performance and lifetime of a wafer product.Therefore,studying the formation of SSCs is important for optimizing SSC-removal processes and thus improving surface integrity.In this study,a statistical method is used to study the formation of SSCs induced during grinding of silicon wafers.The statistical results show that grinding-induced SSCs are not stochastic but anisotropic in their distributions.Generally,when grinding with coarse abrasive grains,SSCs form along the cleavage planes,primarily the{111}planes.However,when grinding with finer abrasive grains,SSCs tend to form along planes with a fracture-surface energy higher than that of the cleavage planes.These findings provide a guidance for the accurate detection of SSCs in ground silicon wafers. | Jingfei Yin Qian Bai Yinnan Li Bi Zhang | 2018 | Nanotechnology and Precision Engineering2018，1，3： | 3 |
| 3 | Bioaccumulation, depuration and oxidative stress in fish Carassius auratus under phenanthrene exposure显示文摘 | Yuanyuan Sun Hongxia Yu Jingfei Zhang Ying Yin Huahong Shi Xiaorong Wang | 2005 | Chemosphere2005，，8： | 1 |
| 4 | Holmium laser e- nucleation of the prostate versus transurethral resection of the prostate: a systematic review and meta - analysis of randomized controlled trials显示文摘 | Lei Yin Teng Jingfei Chen Jung - huang | 2013 | Journal of endourology2013，27，5： | 1 |
| 5 | Influence of alumina abrasive tool wear on ground surface characteristics and corrosion properties of K444 nickel-based superalloy显示文摘K444 nickel-based superalloy is an important material to manufacture the gas turbine due to its excellent mechanical properties at high temperatures and corrosion resistance.Currently,grinding is the mostly used method for the surface finish of the K444 alloy components.However,few studies worked on the effects of the abrasive tool wear on the ground surface characteristics and corrosion properties of K444 alloy.This study uses two different-type alumina abrasive tools,i.e.,white alumina(WA)and microcrystalline alumina(MA)wheels,to grind the K444 alloy.The influence of the alumina abrasive tool wear on ground surface characteristics and corrosion resistance performance are investigated.It is discovered that the MA wheel presents a slighter wheel wear and higher self-sharpening than the WA wheel.Compared to the WA wheel,the MA wheel has less material adhesion,which leads to a better surface finish.In the corrosion testing,the maximum corrosion depth is 80μm in the surface ground by the MA wheel but 100μm in the surface ground by the WA wheel,which demonstrates that the MA wheel grinding benefits the surface corrosion resistance of K444 alloy.Therefore,this study could provide a guide to selecting the abrasive tools and optimizing the grinding process of the K444 alloy. | Min LI Jingfei YIN Linbo CHE Wenfeng DING Jiuhua XU | 2022 | Chinese Journal of Aeronautics2022，35，6： | 0 |
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