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您的检索式：作者名="Hee S.PARK"
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| 1 | 钛沉积工艺制备TiN/cBN和TiC/金钢石涂层颗粒(英文)显示文摘用钛熔盐沉积及热处理工艺分别制备碳化钛涂覆的立方碳化硼颗粒(TiN/cBN)及碳化钛涂覆的金刚石颗粒(TiC/金刚石)。将cBN或金刚石颗粒分别与钛粉和KCl、NaCl和K2TiF6熔盐混合。将所得混合物在Ar气氛中加热至900°C,然后在H2气氛中于1000°C进行热处理。采用扫描电镜、X射线衍射和聚焦离子束技术对所制得颗粒进行表征。结果表明:cBN和金刚石颗粒表面已覆盖了纳米钛层。对Ti/cBN和TiC/金刚石涂层颗粒进行热处理后,颗粒表面沉积的Ti层与cBN和金刚石颗粒发生了原位化学反应,分别转化为钛化合物TiN和TiC。 | Walid M.DAOUSH Hee S.PARK Soon H.HONG | 2014 | Transactions of Nonferrous Metals Society of China2014，24，11： | 7 |
| 2 | Leakage pressures for gasketless superhydrophobic fluid interconnects for modular lab-on-a-chip systems显示文摘Chip-to-chip and world-to-chip fluidic interconnections are paramount to enable the passage of liquids between component chips and to/from microfluidic systems.Unfortunately,most interconnect designs add additional physical constraints to chips with each additional interconnect leading to over-constrained microfluidic systems.The competing constraints provided by multiple interconnects induce strain in the chips,creating indeterminate dead volumes and misalignment between chips that comprise the microfluidic system.A novel,gasketless superhydrophobic fluidic interconnect(GSFI)that uses capillary forces to form a liquid bridge suspended between concentric through-holes and acting as a fluid passage was investigated.The GSFI decouples the alignment between component chips from the interconnect function and the attachment of the meniscus of the liquid bridge to the edges of the holes produces negligible dead volume.This passive seal was created by patterning parallel superhydrophobic surfaces(water contact angle>150°)around concentric microfluidic ports separated by a gap.The relative position of the two polymer chips was determined by passive kinematic constraints,three spherical ball bearings seated in v-grooves.A leakage pressure model derived from the Young-Laplace equation was used to estimate the leakage pressure at failure for the liquid bridge.Injection-molded,Cyclic Olefin Copolymer(COC)chip assemblies with assembly gaps from 3 to 240μm were used to experimentally validate the model.The maximum leakage pressure measured for the GSFI was 21.4 kPa(3.1 psig),which corresponded to a measured mean assembly gap of 3μm,and decreased to 0.5 kPa(0.073 psig)at a mean assembly gap of 240μm.The effect of radial misalignment on the efficacy of the gasketless seals was tested and no significant effect was observed.This may be a function of how the liquid bridges are formed during the priming of the chip,but additional research is required to test that hypothesis. | Christopher R.Brown Xiaoxiao Zhao Taehyun Park Pin-Chuan Chen Byoung Hee You Daniel S.Park Steven A.Soper Alison Baird Michael C.Murphy | 2021 | Microsystems & Nanoengineering2021，7，5： | 0 |
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