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14篇 您的检索式：期刊名="IEEE Trans on Electronics Packaging Manufacturing"

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		题名	作者	年代	出处	被引量
	1	Optimal design for a ball grid array wire bonding process using a neuro-genetic approach 显示文摘	SU C T CHIANG T L	2002	IEEE Trans on Electronics Packaging Manufacturing2002，25，1：	1
	2	An automated meniscus coating system for polymer deposition on large-area MCM-D and MCM-L substrates显示文摘	Bhattacharya S K Bhatevara S Morales H	2000	IEEE Trans on Electronics Packaging Manufacturing2000，23，4：	1
	3	Meniscus coating: a low:cost polymer deposition method for system-on-package (SOP) substrates显示文摘	Bhattacharya S K Moon K S Tummala R R	2003	IEEE Trans on Electronics Packaging Manufacturing2003，26，2：	1
	4	Solder joints inspection using a neural network and fuzzy rule - based classification method 显示文摘	KO K W CHO H S	2000	IEEE Trans on Electronics Packaging Manufacturing2000，23，：	1
	5	Micropositioning of a weakly calibrated microassembly system using coarse-to-fine visual servoing strategies显示文摘	RALIS S J VIKRAMADITYA B NELSON B J	2000	IEEE Trans on Electronics Packaging Manufacturing2000，23，2：	1
	6	Mechanisms un?derlying the unstable contact resistance of conductive adhe?sives显示文摘	Lu Daoqiang Tong Quinn K Wong C P	1999	Electron Packaging Manufacturing IEEE Tran?sactions on1999，22，3：	1
	7	Thermal deformations and stresses of flip-chip BGA packages with low-and high-Tg underfills:Polytronics显示文摘	TSAI M Y LIN Y C WU J D	2005	IEEE Trans on Electronics Packaging Manufacturing2005，28，4：	1
	8	Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives显示文摘	YE L L LAI Z H LIU J	1999	IEEE Trans On Electronics Packaging Manufacturing1999，22，4：	1
	9	Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration 显示文摘	RAO B S HEMAMBAB C PATHAK A V	2006	IEEE Trans on Electronics Packaging Manufacturing2006，29，1：	1
	10	Interfacial reactions between lead-free Sn-Ag-Cu solder and Ni(P) surface finish on printed circuit boards显示文摘	ZENG K KIVILAHTI J K	2002	IEEE Trans on Electronics Packaging Manufacturing2002，25，3：	1
	11	TLP systems with combined 50- and 500-impedance probes and Kelvin probes 显示文摘	EVAN G ROBERT G	2005	IEEE Trans on Electronics Packaging Manufacturing2005，28，3：	1
	12	Decomposition in data mining:an industrial case study 显示文摘	KUSIAK A	2000	IEEE Trans on Electronics Packaging Manufacturing2000，23，4：	1
	13	Rough set theory:a data mining tool for semiconductor manufacturing显示文摘	Kusiak A	2001	IEEE Trans on Electronics Packaging Manufacturing2001，24，1：	1
	14	Micropositio-ning of a weakly calibrated microassembly system using coarse-to-fine visual servoing strategies显示文摘	STEPHEN J R VIKRAMADITYPA B NELSON B J	2000	IEEE Trans on Electronics Packaging Manufacturing2000，23，2：	1

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